6146:TYO
Disco Corp
Â¥50,240.00
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+1.41%(+700.00) 1D
Nov 2, 3:30:00 PM GMT+9 · JPY
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Open
Â¥48,710
High
Â¥51,150
Low
Â¥48,710
Mkt. cap
5.45T
Avg. vol.
1.92M
Volume
1.51M
Dividend
1.12%
Quarterly dividend
Â¥140
Ex-dividend date
Sep 29, 2026
P/E ratio
34.16
52-wk high
Â¥91,680
52-wk low
Â¥42,370
EPS
Â¥1,471
Shares outstanding
35.93M
No. of employees
6K
Open
Â¥48,710
High
Â¥51,150
Low
Â¥48,710
Mkt. cap
5.45T
Avg. vol.
1.92M
Volume
1.51M
Dividend
1.12%
Quarterly dividend
Â¥140
Ex-dividend date
Sep 29, 2026
P/E ratio
34.16
52-wk high
Â¥91,680
52-wk low
Â¥42,370
EPS
Â¥1,471
Shares outstanding
35.93M
No. of employees
6K
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Profile
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
About Disco Corp